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Journal papers (ACM/IEEE transactions)

  • Shin-Ting Wu, Liang-Chi Chen, Po-Chun Huang, Yuan-Hao Chang, Chien-Chung Ho, and Wei-Kuan Shih, “WARM-tree: Making Quadtrees Write-efficient and Space-economic on Persistent Memories,” ACM Transactions on Embedded Computing Systems, Vol. 22, No. 5s, Article 119 (October 2023), 26 pages.
     

  • Wei-Chen Wang, Chien-Chung Ho, Yung-Chun Li, Liang-Chi Chen, Yu-Ming Chang, “Reaping Both Latency and Reliability Benefits With Elaborate Sanitization Design for 3D TLC NAND Flash,” in IEEE Transactions on Computers, doi: 10.1109/TC.2023.3272280.
     

Other journal papers

  • Jyun-Hong Lin, Liang-Chi Chen, Shu-Chi Yu, Yao-Ting Huang, “LongPhase: an ultra-fast chromosome-scale phasing algorithm for small and large variants, Bioinformatics,” Volume 38, Issue 7, March 2022, Pages 1816–1822.
     

Conference papers

  • Shin-Ting Wu, Liang-Chi Chen, Po-Chun Huang, Yuan-Hao Chang, Chien-Chung Ho, and Wei-Kuan Shih, “WARM-tree: Making Quadtrees Write-efficient and Space-economic on Persistent Memories,” ACM/IEEE CODES+ISSS’23 (Integrated with ACM TECS) (top conference)
     

  • Liang-Chi Chen, Chien-Chung Ho, Yuan-Hao Chang, “UpPipe: A Novel Pipeline Management on In-Memory Processors for RNA-seq Quantification,” The 60th ACM/IEEE Design Automation Conference (DAC), San Francisco, CA, USA, July 9-13, 2023. (top conference, 23% acceptance ratio)
            

  • Liang-Chi Chen, Shu-Qi Yu, Chien-Chung Ho, Wei-Chen Wang, Yung-Chun Li, “Efficient Sanitization Design for LSM-based Key-Value Store over 3D MLC NAND Flash,” In Proceedings of the 38th ACM/SIGAPP Symposium on Applied Computing (SAC ‘23),” Association for Computing Machinery, New York, NY, USA, 72–75. https://doi.org/10.1145/3555776.3577780
         

  • Liang-Chi Chen, Shu-Qi Yu, Chien-Chung Ho, Yuan-Hao Chang, Da-Wei Chang, Wei-Chen Wang, Yu-Ming, “RNA-seq Quantification on Processing in memory Architecture: Observation and Characterization,” 2022 IEEE 11th Non-Volatile Memory Systems and Applications Symposium (NVMSA), Taipei, Taiwan, 2022, pp. 26-32, doi: 10.1109/NVMSA56066.2022.00014.
         

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